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After the component is placed on a pickup station, the nozzle with vacuum pickup is placed and lowered over the component and the vacuum is activated The component is raised up and readied for the alignment step 48229 Component-to-PWB Alignment, Placement, and Reflow Generally, a split vision optics system is used and the semitransparent image of the component to be placed is superimposed over the video image of the PWB bonding pads for that component When the two are manually aligned, the component is lowered on to the solder paste- or flux-coated bonding pads and the thermal cycle begins Once reflowed and the solder reaches solidus, the rework process is complete The board is then ready for inspection 482210 Inspection Visual inspection should be conducted as practical to ensure integrity of any visible solder joints and also the area surrounding the rework. datamatrix.net c# example Data Matrix . NET Generator | Using free .NET sample to create Data ...
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DataMatrix . net is a C#/. net -library for encoding and decoding DataMatrix codes in ... PDF files containing DataMatrix codes and other 2D-codes and barcodes ... Ensure that solder mask is not charred or delaminated Also check whether bonding pads have delaminated (not possible on inner rows of area-array packages) For BGAs and other area-array devices, following a visual check, use transmission x-ray to inspect for solder bridges Sometimes this method also reveals lack of solder Lastly, if in-circuit testing or functional testing is done on the first-build product, then it should be applied to the reworked product also.. usb barcode scanner java api, java code 39 reader, c# gs1 128, vb.net data matrix reader, asp.net textbox barcode scanner, gtin 14 check digit excel formula .net data matrix barcode C#. NET Data Matrix Barcode Generator Library | Create Data Matrix ...
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Contribute to msmuelle-astrumit/ DataMatrix . net development by creating an ... the code documentation - improve exception handling and error messages ... Hot-Gas Rework Guidelines Generally the number of SMT solder rework cycles per component per board is kept to two or three. Beyond that, the board should be scrapped to avoid reliability problems. The key in all reflow steps is to limit the amount of time at or near solder liquidus in order to minimize intermetallic compound (IMC) formation. IMC thickness increases with each reflow cycle and is temperature-dependent also. IMC is brittle the weakest link in terms of solder joint structure and resultant joint strength. During component rework and replacement, minimizing thermal excursion is all important. Too often, overly high temperatures are used during rework and dwell at liquidus are prolonged as compared to a normal mass reflow soldering cycle. When a component is removed and replaced, IMC from previous soldering operations or other thermal excursions remain on the pad since the IMC becomes an integral part of the pad. For illustrative purposes, consider the case of a surface-mount component with a copper lead-frame and copper bonding pad and either a leaded (Pb d) or lead-free (Pb-free) solder alloy on the bottom side of the PWB. During the first-pass assembly, the bottom side of the board is built first. During that soldering process, an intermetallic layer forms at the copper lead-to-solder interface and also at the solder-to-bond pad interface. During topside soldering, the components on the bottom side of the board undergo a second reflow. Assume that a part soldered during the bottomside assembly fails and requires removal. The removal and replacement processes necessitate additional reflow cycles to the affected component site, including component removal; site repair, and component replacement. With each soldering cycle, the intermetallic layer builds and reliability generally degrades with increasing Next the cloth is pulled through a series of heating zones. These heating zones commonly utilize forced air convection, infrared heating, or a combination of the two. In the first set of zones, solvent used to carry the resin system components is evaporated off. Subsequent zones are dedicated to partially curing the resin system, or B-staging the resin. Finally, the prepreg is then rewound into rolls or cut into sheets. A number of process controls are required in this operation.The concentrations of the resin system components must be controlled and the viscosity of the resin system maintained within acceptable limits. Tension on the cloth as it is pulled through the treater is also important, for among other reasons, it is vital not to distort the weave pattern of the cloth. Control of the datamatrix.net example DataMatrix . net - SourceForge
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