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resin-to-glass ratio or resin content, the degree of cure of the resin and cleanliness are also critical. Because the resin system at this point is only partially cured, prepregs must typically be stored in temperature- and humidity-controlled environments. Temperature, for obvious reasons, could affect the degree of cure of the resin and therefore its performance in laminate or multilayer circuit pressing. Since moisture can affect the performance of many curing agents and accelerators, not to mention the performance of the resin system during lamination or press cycles, humidity is also important to control during prepreg storage. Absorbed moisture that becomes trapped during lamination cycles can also lead to blisters or delaminations within the laminate or multilayer circuit.

Laminate Manufacturing The process of copper clad laminate manufacturing begins with the prepreg material. Prepregs of certain fiberglass cloth styles and specific resin contents are combined with the desired copper foils to make the finished laminate. First, the prepregs and copper foils are sheeted to the desired size. Figure 6.10 shows an automated copper-sheeting process. These materials are then laid up in the proper sequence to produce the desired copper clad laminate. Figures 6.11 and 6.12 are examples of an automated build-up process where the prepreg and copper foil materials are combined prior to being pressed together. Several of these individual sandwiches of prepreg and copper foil are stacked on top of each other, typically separated by stainless steel plates, although other separator materials, including aluminum, can also be used. These stacks are then loaded into multi-opening lamination

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The use of microsystems and MEMS devices for defence applications is well documented by the DARPA (Defense Advanced Research Projects Agency) [13] A few important examples are given by Michalicek as follows [2]:Inertial navigation on a chip for munition guidance and independent personal navigation Distributed unattended sensors for asset tracking, border control, environmental monitoring, security surveillance and process control Integrated fluidic systems for miniature analytic instruments, hydraulic and pneumatic systems, propellant and combustion control Weapon safing, arming and fuzing to replace current warhead and weapon systems to improve safety, reliability and long-term stability Embedded sensors and actuators for condition-based maintenance of machines and vehicles, on-demand amplified structural strength in lower-weight weapon systems and platforms and disaster-resistant buildings Mass data storage devices for storage densities of terabytes per square centimetre Integrated microoptomechanical components for identify-friend-or-foe (IFF) systems, displays and fibre-optics switches and modulators Active and conformable surfaces for distributed aerodynamic control of aircraft, adaptive optics systems, precision parts and material handling

Displays are an important component in an embedded system. They are one of the most popular ways to communicate with the system user. There are many types of display devices that can be used and interfaced with the AVR processor.

FIGURE 6.14 Lamination press with multiple openings. (Photo Courtesy of Polyclad Laminates, Inc.)

presses (see Figs. 6.13 and 6.14), where pressure, temperature, and vacuum are applied. The specific press cycle used will vary depending upon the particular resin system, the degree of cure of the prepregs and other factors. The presses themselves have many platens that can be heated by steam or hot oil that flows through the platens, or they can also be heated electrically. Process controls in the lamination/pressing process are also critical. Cleanliness in the manufacturing environment and cleanliness of the steel separator plates are critical in achieving good surface quality and in avoiding embedded foreign material within the laminate. Control of the temperature rise during lamination will provide the desired amount of resin flow, while control of the cooldown rate can impact warp and twist. The length of time that the laminate is above the temperature required to initiate the curing reaction will determine the degree of cure, as will the degree to which the actual temperature exceeds this temperature. While these descriptions of prepreg and laminate manufacturing give a simple description of the processes used, it is important to understand that there are many variables that influence the quality and performance of the finished products. In addition, many of these variables interact with each other, meaning that a change in one may influence others and may require adjustments to these other process variables. In summary, prepreg and laminate manufacturing is much more complex than it appears at first glance.

Direct Current or Continuous Foil Manufacturing Continuous foil or direct current manufacturing is an alternative method used to manufacture copper clad laminates (see Fig. 6.15). Prepregs are still used in this process, however, the lay-up and pressing operations are somewhat different. In this process, the copper foils are not sheeted, but kept in rolls. To start, copper foil with the side to be bonded to the prepreg facing up, is laid

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