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The simplest display device is, of course, a LED and we have already seen how it can be connected and used with the AVR But it can provide limited information to the user A LED seven-segment display, on the other hand, can be used to provide numeric information It requires eight signal lines if possible and at least seven at the minimum The display has seven LEDs labeled a through g and then there is a decimal point Figure 630 illustrates a scheme to connect two LED seven-segment displays to the AVR processor This puts an immense resource load on the processor Interfacing a couple of sevensegment displays takes up all the I/O pins The situation is remedied by using a multiplex scheme Here, at the cost of increased software complexity, some of the I/O pins can be saved while at the same time more displays can be added.

As mentioned previously, time above solder liquidus along with peak temperature will define the intermetallic thickness for a given metals system, and intermetallic thickness will in part define the solder joint reliability The turbulence of the.

One of the most important MEMS devices in industrial applications is none other than the manufacturing process sensors These process pressure transmitters are consumed at a rate of about 200,000 units per year [6] In addition, some MEMS devices serve as sensors for hydraulic systems, paint spray, agricultural sprays, refrigeration systems, heating, ventilation and air conditioning systems, water level controls, digital micromirror devices, grating light valves, optical interconnects and telephone cable leaks In chemical applications, they are used as lab-on-a-chip and as microreactors

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solder fountain is known to enhance dissolution of certain metals into the molten solder of the fountain. Copper PTH barrels can be thinned and PTH annuli (bonding pad atop the PTH) can be thinned or completely dissolved, impairing the degrading solder joint either to make a connection or to ensure long-term reliability. The high turbulence, high temperature, and long dwell times all hasten dissolution in this fashion. For this reason, precise process control, including strict exposure time limits and minimum solder pot temperature, must be imposed for this largely manual operation. This process is best suited for repair and should be avoided, if at all possible, for first-pass soldering of printed circuit assemblies.

This version of the solder fountain incorporates a programmable head and is used mostly for first-pass soldering, but can be an effective soldering repair tool once the PTH component is removed, the site is prepped, and a new component is placed. A programmable nozzle emitting a precise jet of molten solder is directed at the leads of the component to be soldered.The nozzles allow point soldering of very fine PTH pitches.

Laser is a recent innovation in rework and repair. The fundamentals of laser for initial soldering or for repair have already been discussed in Chap. 47. In the commercial incarnation of this technique, a laser beam is quickly scanned around component leads or, package surface, in the case of area-array devices such as BGAs and chip-scale packages (CSPs). It is most effective for plastic packaged components rather than the thermally massive CBGAs, CCGAs, and so on. In this technique, the component body is heated. Otherwise, there is little difference between this and alternative rework or repair techniques. Since the energy of the laser beam is more tightly confined to the area it irradiates, the heating is more localized. This can be advantageous when trying to remove or replace a component on a densely populated, double-sided PCA. Otherwise, the same caveats must be kept in mind regarding IMC formation and pulling components before they are fully reflowed. Care must be taken to assess carefully the assembly for laser damage threshold so as not to char components or PCAs during either removal or component resoldering.

48.6.1 Mixing Aqueous With No-Clean Chemistries Care must be taken when using fluxes for the rework and repair processes. If an aqueousclean solder chemistry is used for building the PCA, then either no-clean or aqueous flux formulations can be used. If an aqueous chemistry is used for the repair, then the board must be subjected to another aqueous cleaning cycle. Be sure to check that all components at that stage are compatible with the aqueous cleaning process. No-clean solder flux formulations can be used for rework and repair even if the PCA was manufactured with an aqueous clean chemistry, although the reverse is not recommended. Sometimes when a no-clean board is subjected to an aqueous cleaning, the no-clean flux residue takes on a white, gummy characteristic that is conducive to dendritic corrosion, which can result in soft or hard electrical shorting. Saponified aqueous cleaning can be used, but must be tested for effectiveness in removing the polymerized flux residue from the no-clean process and for compatibility with the selected no-clean flux to avoid generation of corrosive byproducts.This is particularly important under connectors, area-array devices, and other components with low headroom between the underside of the body and the PWB surface.

Microelectro-mechanical Systems (MEMS)

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