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Pooled Flux Another consideration with no-clean solder chemistries is that of pooled, unactivated flux residue. No-clean solder flux is generally harmless after it has gone through the thermal cycle associated with solder reflow. It is activated and denatured by the heat. If the flux is applied generously and the flux pool does not see the high temperatures associated with solder joint formation, acids remaining in the unheated flux residue can cause reliability problems. These acids are normally denatured, evaporated, or sublimed through the high-temperature excursions of the soldering process. If the flux acids remain, corrosion can occur in the long term. There are commercial flux solvents that can be used to dilute and wash away excess flux; otherwise, the assembly can be baked briefly to about 120 C to denature the flux. Check with the flux manufacturer for specific recommendations regarding flux residue management. The problem can be avoided by eliminating the use of liquid flux and using small amounts of paste flux instead. In the case of core wire, use the smallest diameter practical to limit flux residue.

This scheme has the advantage that our eye cannot follow any light change faster than about 20 Hz So if an LED display is put on and off at a rate greater than 20 Hz, due to the persistence property of the eye, it will not feel any difference, provided that the average intensity of the LED is maintained Thus, many LED displays can share the same I/O lines, with only one of them being lit at any time Figure 631 illustrates how four LED displays can connect to the AVR controller using the multiplex scheme The power to each display (common anode type display) is controlled by an output signal line of the AVR through a PNP transistor switch A 0 at the base turns it ON and provides voltage to the display At any given time, only one of the transistors is turned ON.

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Component Bake-Out Components that have been sitting out may be subject to water absorption. When components are heated during rework, where the heating cycle is more localized and perhaps more extreme than in the slow heating experienced during mass oven reflow soldering, moistureinduced popcorning may be a more serious problem. Follow IPC or component manufacturer recommendations for presoldering moisture bake-out. Refer to Sec. 50.2.2.5 for further discussion on this topic.

Gold Finger Protection There is ample opportunity to ruin gold edge connector fingers on a circuit board during the repair operation. Care should be taken to keep both solder and flux away from gold fingers during repair. Mechanical shields or acrylic-adhesive polyimide tape can be used to protect fingers from smeared solder paste, loose solder debris, or flux. If solder comes into contact with gold, the gold will rapidly dissolve into the solder mass and the solder will spread on the finger. The solder cannot be removed from the gold finger without scraping and replating, a costly process. Solder is not a reliable connector contact material, especially with today s highdensity, low normal-force electrical connectors. Keep solder away from gold fingers. Keep gold finger temperature as low as possible. Ensure that gold fingers are never handled, even with gloved hands. Avoid lint and fibers. After rework, clean gold fingers with a suitable solvent. Use a soft brush, lint-free cloth, or other nonabrasive material for this cleaning. Clean gold fingers on each side of the board separately. Avoid folding the lint-free cloth over both edges and wiping repeatedly; the cloth will wear against the glass-epoxy expunge and shred, leaving lint on the board. A better alternative is to use a soft, ESD-safe brush with solvent to clean the gold fingers and follow with a filtered-air blow-off to dry. Avoid any materials that will scratch the gold surface finish on the fingers. The underlying nickel, if exposed to the atmosphere will oxidize and, is known to be problematic for separable contact reliability.

1. IPC/JEDEC J-STD-033, Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices.

[4] Micromachined turbine engines, MEMS power generators and fuel cells are used in power generation

Electronic connectors are attached to printed circuit boards in four ways (see Fig. 49.1):

Oven reflow surface-mount technology (SMT) soldering Wave soldering (for solder-tail components) Pressure interconnect, a solderless method relying on mechanical forces to hold interconnect elements together to make contact Press-fit, another mechanical, solderless method (which is the subject of this chapter)

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